• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    lighting device and method for providing a lighting device. an illumination device 100 is provided in which at least one light source 121 is arranged to generate light. the lighting device comprises an electrically insulating heat sink element 111 in which an electrically conductive layer 120 is arranged by means of a mechanical fixing means 130. at least one light source is arranged in contact with the electrically conductive layer.
    公开号:BR112013017690B1
    申请号:R112013017690
    申请日:2012-01-04
    公开日:2020-01-21
    发明作者:Adrianus Maria Marinus Antonius；Van Der Padt Arie；Nikol Hans；Johannes Martinus Bukkems Peter
    申请人:Koninklijke Philips Nv；Philips Lighting Holding Bv；
    IPC主号:
    专利说明:

    LIGHTING DEVICE AND METHOD FOR PROVIDING A LIGHTING DEVICE
    FIELD OF THE INVENTION
    The present invention generally relates to a lighting device and a method for mounting a lighting device, which are suitable for mass production of retrofit LED lamps.
    HISTORY OF THE INVENTION
    For high commercial penetration of LED lighting devices (LED lighting devices), retrofit lamps are of great importance. LED-based retrofit lamps are typically used to replace traditional incandescent lamps, and are referred to here as LED lamps. A typical solution for arranging the LEDs in a retrofit lamp, such as the Philips Endura LED Lamp, is to arrange the LEDs on printed cardboard, PCBs, whose PCBs are then mounted with metal screws in a heat sink that forms part of the base of the LED lamp. The metal heat sink is typically prepared with pre-drilled holes so that the PCBs can be mounted in a predetermined position. In addition, the LED lamp usually comprises a socket connected to the base and a glass lamp arranged to surround the LEDs.
    While the system described above is generally effective when making an effective LED lamp, in which the heat generated by the LEDs is evacuated through the metal heat sink, there is a need for an alternative method for mounting the LEDs on an LED lamp.
    SUMMARY OF THE INVENTION
    It is an objective of the present invention to provide at least an improved lighting device and a method for
    2/26 assemble such a lighting device, which is well suited for mass production.
    objective is achieved by a lighting device and method according to the concept of the present invention as defined in the attached independent claims. Preferred embodiments are set out in the dependent claims and in the following description and drawings.
    Thus, according to a first aspect of the concept of the present invention, a lighting device is provided comprising at least one light source arranged to generate light, an electrically insulating thermal dissipating element, and one, the electrically conductive layer. At least one light source is arranged at least in thermal contact, but preferably still in electrical contact, with the electrically conductive layer, and the electrically conductive layer is mounted on the heat sink element by means of a mechanical fastening means. Thus, in order to achieve a good fixation of the electrically conductive layer in the heat sink, a mechanical fixation means is used, which is useful as compared, for example, gluing, or coating techniques, for example, using thick layer technologies, or thin film processes, which all require expensive equipment and complicated process in need of treatment, use of chemicals. Furthermore, with the correct design of the mechanical fixing means, it can be used as an advantageous way of aligning one or more light sources in the predetermined positions in the thermal dissipating element. This can be achieved, for example, by providing a mechanical fixation means with a recess for receiving the light source (which is typically arranged so that it projects over the electrically conductive layer). When fixing the electrically conductive layer and the light source, the light source is guided by the
    3/26 recess, so that a predetermined position in the heat sink element is obtained for the light source. In addition, the design of the fixing means can be done so that alignment in the fixing means itself is facilitated, for example, using the shape of the heat sink element. It should be noted that the fixing means can be of the friction lock type (non-positive) as well as the shape lock (positive) type.
    In the preferred embodiments of the lighting device, the electrically conductive layer is disposed between the light source and the electrically insulating heat sink element, thus providing a low thermal resistance between the heat generating light source and the heat sink element. Thus, efficient heat transfer from the light source and heat dispersion to the heat sink element are performed. A low thermal contact resistance is, for example, obtained by using copper, or a copper alloy, to form the electrically conductive layer, which is then arranged in direct contact with, for example, a ceramic heat sink element. This arrangement requires fewer parts than the prior art PCB-mounted lighting device as discussed above. In addition, the fixation means can be arranged so that the predetermined degree of freedom of movement is allowed, which reduces the impact of the incompatibility of the Thermal Expansion Coefficient, CTE. This, in turn, means less weld heat at high temperatures (above 100 ° C). It should be noted that the electrically conductive layer can be monolithic or in several layers, for example, including a 'conductive deposited' frame on an electrically insulating thermally conductive substrate to connect the light source to an energy source.
    According to an embodiment of the
    4/26 lighting, the fixing means is arranged to distribute a mechanical force in the predetermined positions. The positions can advantageously be selected on the electrically conductive layer and in close proximity to at least one light source. Thus, in addition to fixing the electrically conductive layer on the heat sink element, the fixing means can provide sufficient thermal connection between the electrically conductive layer and the heat sink element in the thermally critical positions, that is, directly on the heat sources. This can be achieved, for example, by selecting an appropriate design of the upper and lower contact surfaces of the fastening means. That is, the fixation means is designed so that the electrically conductive layer and the heat sink element are pressed together by the fixation means in the predetermined positions. As mentioned above, these positions are preferably selected next to each light source, so that a good thermal contact next to each heat-generating light source is provided. Thus, in an assembly step, the electrically conductive layer, which is in contact with the light sources, is attached to the heat sink element, while the mechanical strength of the fixation medium is distributed to provide sufficient thermal contact close to the light sources. (or any other heat-generating component), effectively.
    Also, by applying separate pressure points for each light source, the lighting device becomes less sensitive to irregularities or flaws in the leveling of the heat sink element. This will reduce the cost for producing the thermal contact surfaces, as less attention to leveling is required.
    According to an embodiment of the
    5/26 lighting, the fixing means is a clamp. The clamp can be made of metal, but it can also be provided with an electrically insulating material. Using a clamp, a good thermal contact between the electrically conductive layer and the heat sink element is obtained in a convenient way. The clamp can advantageously be arranged to apply a predetermined force to make sufficient thermal contact between the electrically conductive layer and the heat sink element, as described above. The clamp can be assembled in one assembly step. The advantages of the fixation medium being a clamp, for example, when comparing the use of screws to fix a PCB in the heat sink as in the prior art there are many. The latter requires several steps to complete the assembly, and delicate handling, for example, of the screws. Also, applying the correct amount of torque to the screws is essential, as too high a torque can result in a damaged PCB, while too low a torque can result in an improper thermal contact between the PCB and its thermal heatsink (here corresponding to the heatsink element. thermal). However, using a clamp according to the concept of the present invention allows to provide a very precisely defined clamping force and quick assembly.
    According to an embodiment of the lighting device, the electrically conductive layer is arranged having electrical cables arranged to provide at least one light source. The electrically conductive layer is preferably, in addition to providing thermal coupling between the light source and the heat sink element, designed to provide the electrical cables arranged to supply the light source which is advantageous.
    According to an embodiment of the lighting device, the electrically conductive layer is flexible. An
    6/26 flexible electrically conductive layer is advantageous as it can be folded, for example, around the heat sink element. In addition, a flexible electrically conductive layer provides an improved contact area between it and the heat sink element.
    According to an embodiment of the lighting device, it further comprises an insulating layer disposed in the electrically conductive layer. The insulating layer may be arranged to support the electrically conductive layer, for example, when the electrically conductive layer has cut / eliminated wire patterns. It can also be arranged as an upper layer, covering most of the upper surface, except for areas where the light source (s) is (are) placed. The insulating layer can be used to increase the security of the lighting device by isolating the living parts, in the case of a broken housing (glass lamp) of the lighting device, etc. The insulating layer can also be used for positioning functions. It should be noted that the insulating layer can also be an integrated part of the electrically conductive layer.
    According to an embodiment of the lighting device, the insulating layer (if present) and / or the fixing means are reflective, which is advantageous to provide good light performance, that is, to achieve a high optical efficiency of the device lighting.
    According to an embodiment of the lighting device, the electrically conductive layer is arranged in the fixing means. The electrically conductive layer may, for example, be arranged covering all contact surfaces with a plastic clamp, and be applied as electrical cables that are arranged to connect the light source to a power source. Thus, a convenient way to arrange the electrical cables in the light source is provided, while
    7/26 at the same time provides a sufficient thermal connection between the light source and the heat sink element.
    According to an embodiment of the lighting device, the electrically conductive layer and the fixing means coincide. The fixing means can, for example, be a metal clamp on which the light source is mounted. This provides a good thermal connection between the light source and the heat sink element and keeps the number of components low. The electrical supply of the light source can be provided by the electrically conductive layer, but it can also be obtained by means of dedicated electrical connection. The light source can be, for example, an LED package or chip-on-board (tablet on the board) (COB). Here, an LED package can refer to LEDs with protective coating or some type of mechanical reinforcement, not mainly to LEDs with unprotected wires facing downwards that must be welded or mounted on the surface directly to a substrate. However, the light source can also be provided in the form of one or more LEDs in a separate matrix (ie, without a dedicated protective coating) forming the electrically conductive layer. The matrix is mounted directly on top of the heat sink element, so that heat is dissipated away from the LEDs through the matrix to the heat sink element, at low thermal resistance. Regardless if a package or a separate matrix is used, the preferred way to connect the light source is by connecting wires. it is observed that this realization is fully operational even if the matrix is not electrically conductive; it is important, however, that the matrix has good thermal conductivity in the transverse direction.
    According to one realization. of the lighting device, the mechanical fixing means is a recess in the heat sink element having a shape corresponding to the
    8/26 of the electrically conductive layer. Through a recess it includes a notch, cavity or hole that can be used to help align the light source. When the electrically conductive layer is received in the recess, the movement of the electrically conductive layer in its own plane is limited. In addition, the electrically conductive layer is bonded to the heat sink element. The light source can be, for example, an LED package or chip-on-board (COB). The present embodiment has a small number of components, and since the recess can be shaped or cut as part of the manufacture of the heat sink element, the present embodiment is easy to assemble. If necessary, an extra clip can be arranged to help keep the conductive layer attached to the heat sink element. This promotes the thermal connection to the heat sink.
    According to an embodiment of the lighting device, auxiliary means of linear electrical connection are arranged so that they extend all the way to the light source to provide electrical energy. This is preferable since the electrically conductive layer does not need to include a conductive frame for the electrical energy to be supplied. The linear connection means can, for example, be wires, insulated or non-insulated. In addition, the linear connection means can extend from inside the lamp socket, where the drive circuit or a power supply can be located, all the way from the light source or conducting wires that connect the linear connection means to the light source. Cable connection is currently the preferred way of connecting the linear connection means to the light source or its conducting wires. The use of auxiliary linear electrical connection means is preferable since it increases the shock resistance of the lighting device compared to the realizations with conductive frames or other
    9/26 large rigid components.
    According to an embodiment of the lighting device, each auxiliary linear electrical connection means is located on this side of the heat sink element which is opposite the light source, until this linear connection means extends. Thus, the linear connection means do not hide the light emitted from the light sources.
    According to an embodiment of the lighting device, the heat sink element comprises two overlapping parts. These parts are separated by a positive distance, so that an overlap zone is formed between them, where the means of electrical connection are located. This is preferable, as the linear connection means are held in position by the heat sink element. The overlapping parts can, for example, be parallel plates separated by an essentially constant distance, for example, 1-10 millimeters. The overlap zone is preferably located in a central region of the lamp.
    According to an embodiment of the lighting device, it comprises a housing that includes the light source and the thermal dissipating element, which is advantageous.
    According to an embodiment of the lighting device, the thermal dissipating element is thermally coupled to the enclosure, providing a lighting device that has its light source (s) arranged within the enclosure and a thermal dissipating element that is thermally connected to the enclosure. Thus, efficient heat transfer from the light source and heat dispersion to the heat sink and housing element is carried out.
    According to an embodiment of the lighting device, at least part of the heat sink element and the housing are a single integrated part. That is, the
    10/26 heat sink element is part of the enclosure, for example, the glass lamp or a lamp. Fewer parts are then needed, and fabrication is done in a simpler way, for example, molding the heat sink element and the casing into a common mold and the same material is made if possible.
    According to an embodiment of the lighting device, the heat sink element comprises a ceramic material, which is advantageous. A preferred material is a transparent polycrystalline aluminum oxide, PCA. It can be provided with excellent optical properties for lamps, as providing a high total light transmission while providing a light scatter to fade out spot light sources like LEDs. In addition, the PCA provides very good electrical insulation and has a thermal conductivity of 35 W / mK. Thus, the thermal management of the lighting device is improved. This allows for the high level of integration of the device's function, thus reducing the number of parts that are needed for lamps using a traditional metal heat sink and plastic reflectors and / or diffusers.
    According to a second aspect of the concept of the invention, a method is provided to provide a lighting device comprising: provision of an electrically conductive layer, mounting at least one light source on an upper surface of the electrically conductive layer, fixing the electrically layer conductive in an electrically insulating heat sink element, so that an underside of the electrically conductive layer is arranged in direct contact with the heat sink element, in which the step of fixing the electrically conductive layer to the heat sink element is done by means of mechanical fixation. Thus, a highly recognized mechanical solution and
    11/26 very simple that requires only a few components, for mounting a lighting device with a light source, for example, in a lamp is obtained. The method is advantageously suitable for mass production of lighting devices. .
    According to an embodiment of the method, further comprising a step of providing an electrical wire pattern to the electrically conductive layer, which is advantageous. A step of providing an electrical wire pattern can advantageously be done by stamping means. Stamping is advantageous since a large number of patterns of the electrical wire can be simultaneously removed from an electrically conductive layer, such as a roll of copper foil. However it must be emphasized that other suitable methods are applicable to obtain a yarn pattern are applicable to the concept of the invention.
    According to an embodiment of the method, this additionally comprises the provision of an electrically insulating layer, and the arrangement of the electrically insulating layer in the electrically conductive layer.
    These and other aspects, characteristics, and advantages of the concept of the invention will be evident and explained with reference to the realizations described below. It is noted that the invention relates to all combinations of characteristics, even if they are recited in different claims.
    BRIEF DESCRIPTION OF THE DRAWINGS
    The concept of the invention will now be described in more detail and with reference to the accompanying drawings in which:
    Figure 1 is an enlarged perspective sectional view showing the main parts of an embodiment of a lighting device according to the concept of the present invention;
    12/26
    Figure 2 is a cut-away perspective view
    illustrates an realization of one device lighting in wake up how concept of the present invention; At figures 3a-c are illustrations schematic in phases in an achievement in a method to ride one device lighting in a deal with . the concept gives
    the present invention;
    Figures 4a - b illustrate parts of an embodiment of a lighting device in accordance with the concept of the present invention;
    Figure 5 is a perspective view of an embodiment of a lighting device in accordance with the concept of the present invention;
    Figure 6 is a perspective view of an embodiment of a lighting device in accordance with the concept of the present invention;
    Figures 7a-b and 8 illustrate realizations of a
    lighting device in according to concept of the present invention; and Figure 9 is an upper view transversal schematic of any an of achievements of figures 7a-b and 8. DESCRIPTION OF PREFERRED ACHIEVEMENTS
    The concept of the present invention will now be described more fully with reference to the accompanying drawings. The achievements below are provided by way of example so that this disclosure will be thorough and complete, and will completely lead the scope of the invention concept to the skilled artisan. The same numbers refer to the elements. In the following, the invention is further described with reference to a light emitting diode, LED, as the preferred embodiment of the light source. This includes single LEDs, multicolor LEDs, phosphor LEDs, LED package comprising several LEDs, etc. Still,
    13/26 the concept of the present invention is applicable to both solid-state light-emitting diodes and organic light-emitting diodes, OLEDs.
    Figure 1 is a cut-away perspective view of a lighting device 100 according to the concept of the present invention showing one half of the lighting device, which is enlarged to illustrate the main parts thereof. Also, in this figure, the socket to connect the lighting device to a luminaire, and electrical wires to connect the power to the light source, are left out to simplify. The lighting device 100 comprises light sources 121 arranged to generate light, which are mounted on a substrate 120. The substrate 120 is described in more detail here with reference to figures 3 and 4.
    The light sources 121 are here simple LEDs red green amber white or blue which are soldered on the electrical cables (not visible) arranged on the substrate 120. The lighting device additionally comprises a housing 110, here referred to as the lamp. A heatsink element 111 is arranged as a projection part of an inner surface of the lamp 110, on which heatsink element 111 the substrate 120 is positioned when the lighting device 100 is mounted. The heat sink element 111 is here the plate formed with an internal profile 113 that follows the internal curvature of the lamp 110, and a straight opposite outer edge 114. A projecting part 112 is arranged on the outer edge 114 to provide a guide for the substrate 120 and a clamp 130 for securing the substrate to the heat sink element 111, the clamp of which is described in this document. The heat sink element 111 and the lamp 110 are thermally coupled, and can in alternative embodiments be formed as an integrated part.
    According to the achievements of the
    14/26 lighting, the enclosure can be manufactured in one piece, or be formed by at least two parts that are joined to form the enclosure (not shown).
    According to an embodiment of the lighting device, the enclosure, and optionally still the heat sink element, comprises ceramic material. The ceramic material can, for example, be based on one or more materials selected from the group consisting of A1 2 O 3 , A1N, SiO 2 , Y3A1 5 0i 2 (YAG), an analogue Υ 3 Α1 5 Ο Χ2 , Y 2 O 3 and TiO 2 , and ZrO 2 . The term an analogue Y 3 A1 5 0i 2 refers to garnet systems having substantially the same lattice structure as YAG, but in which Y and / or Al and / or O, especially Y and / or Al all at least partially substituted by another ion, with one or more of Sc, La, Lu and G, respectively. The term based on indicates that the starting materials for making the ceramic material consist substantially of one or more of the materials indicated here, for example, A1 2 O 3 or Y 3 A1 5 0i 2 (YAG). This, however, does not exclude the presence of small amounts of binder material (remainder), or dopants, such as Ti for A1 2 O 3 , or in a Ce for YAG realization. The ceramic material can have a relatively good thermal conductivity. Preferably, the thermal conductivity is at least approximately 5 W / mK, such as at least approximately 15 W / mK, even more preferably at least approximately 100 W / mK. YAG has a thermal conductivity in the range of approximately 6 W / mK, polycrystalline alumina (PCA) in the range of approximately 20 W / mK, and A1N (aluminum nitride) in the range of approximately 150 W / mK or greater.
    To continue, with reference to figure 1, the heat sink element 111 and the lamp 110 are made of A1 2 O 3 , which is a transparent material. A1 2 O 3 can also be made highly reflective when sintered in a
    15/26 temperature in the range of approximately 1300-1700 ° C, as in the range of approximately 1300-1500 ° C, as in 1300-1450 ° C. This material is also known in the art as brown PCA (polycrystalline alumina).
    In an assembled state of the lighting device 100, as described in figure 2, the lamp 110 surrounds the light sources 121 and the heat sink element 111. The lighting device additionally comprises a metal clamp 130 arranged to fix the substrate 120 to the element heat sink 111 when mounted. The substrate 120 is here folded on a fold axis to fit around the heat sink element 111 and is provided with an opening 129 arranged on the fold axis to receive the projecting part 112, that is, the guide on the heat sink element 111 when mounted. Clamp 130 is a cut sheet metal which has been formed and folded over a bending axis to form a clamp with two sets of opposing elastic fastening parts. The clip 130 is arranged to receive the heat sink element 111 and the substrate 120 between these two sets of opposing elastic fastening parts, which thus provide a mechanical force that compresses the substrate 120 and the heat sink element 111. The two sets of parts opposite elastic fixing clips of clip 130 are partially illustrated in figure 1, in which the subparts 131, 133, and 134 that together form the upper assembly for holding one of the light sources 121 are completely visible. As can be seen, the extension of subparts 131 and 134 in a forward direction of the fold axis of clamp 130 is longer than for subpart 133, which is arranged between subparts 131 and 134. The length of subpart 133 defines a predetermined distance from the bending axis. In addition, the lateral separation between subparts 131 and 134 is selected so that the light source is advantageously received by the clip 130.
    16/26
    Thus, the positioning in two dimensions of the light source 121 in the heat sink element 11 is obtained by means of the clamp 130, that is, the distance from the rear axle, and the lateral position by positioning the recess formed by the separation of the subparts 131 and 134 .
    The profiles of the subparts 131, 132, 133, 134 (and other subparts that are not visible in the figures) of the clip 130 are arranged with rounds 131a - 134a, to create contact surfaces, whose surfaces face the heat sink element 111 in an assembled position, so that the mechanical force of the clamp is distributed in the predetermined positions, preferably close to the light source 121. Having a predetermined design, elasticity and material of the clamp 130, a predetermined mechanical force is applied to fix, and to guarantee sufficient thermal connection, substrate 120 and heat sink element 111.
    In an embodiment of the lighting device, the fixing means is a clamp comprising two opposing fixing parts which can be put together by means, for example, of a screw, or a spring, to provide the fixing of the substrate on the heat sink element (not shown).
    To continue with reference to figure 2, it still illustrates the power details for the lighting device 100. At a lamp entrance 110, a power plate 142 is arranged so that a part of the receiving connector 143 faces the heatsink element thermal 111. Thus, when the heat sink element 111 and the supply plate 142 are mounted, they are fixed together. The electrical cables (not visible here, see 122 in figure 4a) are arranged on the substrate 120, which is positioned so that the electrical cables connect to the connection part 143 when mounted on it. The electrical interconnection of light sources 121
    17/26 and the driver is then provided at the edge of the substrate 120 and at the connection part 143, which, in turn, is coupled through the electrical cables 141 to the drive circuit disposed in the bushes 140 (not shown).
    In one embodiment of the lighting device 500, described with reference to figure 5, the lighting device 500 comprises a cylindrically formed and substantially concave ceramic heat sink 511 having a partially closed top surface 511c, and which is connected to a bushing 540 at the opposite bottom end. The cylindrical shape of the heat sink 511 is provided in two stages, 511a and 511b, with two different diameters, so that the upper part 511a of the heat sink element has a smaller diameter, thus having the lower part 511b. In the upper surface 511c of the upper part 511a, an opening 543 is provided. The lighting device 500 additionally comprises a flexible substrate 520 comprising a plurality of rectangular parts of the substrate 523, which each at an upper end is fixed to a joining strip 524 forming a circle, only the outer diameter of the upper part 511a of the heatsink element 511. The substrate 520 is arranged with electrical cables (not visible) arranged under an insulating top layer. In each part of the substrate 523, a respective light source 121 is welded to the connection points that are not covered by the insulating top layer (the connection points are not visible here, but compare to points 124 for electrical connection to a light source in figure 4b). When manufacturing substrate 520, the substrate parts 523 can advantageously be processed from a rectangular part comprising the substrate parts 523 and the joining strip 524 (during stamping, providing insulating layer, assembly of the light sources etc.). Subsequently, the ends
    18/26 external of the junction strip 524 are joined so that the junction strip forms a circle. In addition, a power part 522 for connecting to the driver is attached to the junction strip 524.
    The substrate 520 is arranged on top of the heat sink element 511 so that the upper part 511a is projecting through the junction strip 524. The parts of the substrate 523 are spaced around the heat sink element, and due to their flexibility they are suspended from the junction strip 524, basically covering the side wall of the lower part 511b of the heat sink element. The supply part 522 is arranged to enter the heat sink element. 511 through opening 543, and is still connected to the drive circuit (not shown).
    To fix the substrate 520 to the heat sink element 511, a clamp 530 is disposed on the substrate 520. The clamp 530 is a metal ring-shaped clip having a plurality of parts of the clamp 533 adapted to fit each part of the substrate 523. The parts of the clamp 533 are then, to fit in a part of the corresponding substrate 523, spaced around an upper joint ring 534. A recess in each part of the clamp 533 is formed by the two adjacent portions 531 and 532. recess is provided for the clamp 530 to fix the light sources 121 of the substrate 520 in the predetermined positions. The upper rim 534 is arranged having an opening with a suitable internal diameter to allow the upper part 511a of the heat sink element 511 to project through the opening. The shape of the clamp 530 is adapted to receive the bottom part 511b of the heat sink while distributing a mechanical force to fix the parts of the substrate 523 and thus provide sufficient thermal contact between the substrate 520 and the heat sink element 511.
    19/26
    According to an embodiment of the lighting device, the fixing means is arranged in an electrically insulating material, such as, for example, plastic.
    According to an embodiment of the lighting device, the substrate is an electrically conductive layer comprising two subparts that are electrically separated, for example, with a gap (not shown). The anode of the light source is electrically attached to one of the subparts and the cathode of the light source is electrically attached to the other subpart. The substrate is positioned directly on the heat sink element, and fixed to it by means of a plastic clip.
    According to an embodiment of the lighting device, as shown in figure 6, the light source here being a 621 LED package, is arranged in a ceramic heat sink 611 element, so that its heat block (not visible) be placed directly on the ceramic surface. Plastic clamps 630, which are arranged with electrical contacts (not visible), are arranged to hold the LED package in a predetermined position, and to connect the LED package electrically. The clamps can alternatively be completely made of an electrically conductive material and thus provide the electrical contacts.
    The fixing means, for example, the clamp, above is described as an example and it should be emphasized that other suitable designs are applicable and are considered for the scope of the concept of the invention.
    Now to continue with reference to figure 3, an embodiment of a method for assembling a lighting device according to the concept of the invention is described in more detail. The method is formed to facilitate the mass production of lighting devices. To form a large number of substrates for the devices of
    20/26 lighting according to the concept of the present invention, initially a copper foil (or foil) or other suitable metallic foil is provided. A roll of copper foil 301 is inserted into a stamping press 350, in which the wire patterns for a variety of substrates are perforated simultaneously at each stage of the process (i.e., gradually or continuously in an advance process). The electrical wire pattern for each substrate is preferably designed to provide the necessary electrical connections for each individual light source, and in addition to providing a large area of copper sufficient to provide sufficiently low thermal resistance between a finished substrate and its heat sink element corresponding. See figure 4, which illustrates the finished wire pattern for a substrate 120, in which points 122 for connection to connection part 143 as described above, points 124 for electrical connection to a light source, and copper surfaces 120a , 120b for providing thermal connection surfaces are shown. In figure 4, the electrical wire pattern is arranged to connect two LED 121 packages. A bending axis x is shown in the figure, to illustrate that the finished substrate, after assembling the 121 light sources, will be bent.
    According to an embodiment of the method, and with reference again to figure 3, the finished substrates are preferably provided with an insulating layer. To manufacture insulating layers for a large number of substrates, here a roll of epoxy sheet reinforced with fiberglass (FR4) is provided. Other standard materials used in PCBs are applicable for use as an insulating layer, for example, PI, and PA.
    In figure 3b the insulating sheet roll 302 is inserted into a stamping press 351, in which a number
    21/26 of patterns, corresponding to the number of substrates stamped on the copper foil 301, and adapted to fit on a respective substrate, are perforated simultaneously at each stage of the process (that is, gradually or continuously in an advance process). The pattern is adapted to cover the electrical wire pattern of each substrate, preferably covering the entire upper surface of the electrically conductive layer 120 except for areas dedicated to electrical connections, and for areas where light sources are to be mounted, see figure 4b, where an insulating layer 127 is attached to the copper layer, i.e. substrate 120, of figure 4a. The insulating layer is covering the entire surface of the electrically conductive layer 120 with the exception of areas for connection points 122, and 124, and areas 126 in which LEDs 121 are to be mounted.
    To continue now with reference to figure 3c, the stamped copper foil 301 'and the stamped insulating sheet 302' are reduced to position and then glued together on a gluing machine 352, thus forming a roll of connected substrates 300.
    Before separating the substrates, the light sources are arranged on an upper roll surface of the connected substrates 300 by means of standard techniques for placing and assembling the light sources, such as pick and place machines and reflux welding (not shown) .
    The substrates are then separated and ready to be attached to a heat sink element in a housing of the lighting device. The final substrate can be rigid or flexible. The flexible substrates facilitated the folding of the substrate on the heat sink element to take advantage of two sides of a flat heat sink element, thus allowing light sources on both sides of the heat sink element. The substrate is arranged with
    22/26 its bottom side facing the heat sink element, that is, the bare copper is disposed directly on the heat sink element.
    According to an embodiment of the method, the step of fixing the electrically conductive layer on the heat sink element is done by means of a mechanical fixing means.
    Figures 7a-b and 9 illustrate an embodiment of a lighting device 100 in accordance with the concept of the present invention. In figure 7a, the lighting device is illustrated in a disassembled state to show its main parts, while figure 7b shows the lighting device in an assembled state. Figure 9 is a simplified cross-sectional top view of the lighting device shown in Figure 7b in an assembled state.
    The lighting device 100 comprises light sources 121, arranged to generate light, which are mounted on two clamps 130. Light sources 121 are, for example, LEDs of arbitrary color. It should be noted that there are light sources not visible in figures 7a-b since they are mounted face down on one of the clips 130. In the present embodiment, the clips 130 act as electrically conductive layers, for example, including metallic particles or elements in the positions where they help to reduce the thermal resistance between the top and bottom sides of the layer.
    The clamps 130 and the light sources 121 are surrounded by an enclosure consisting of two parts of the enclosure formed by two lamps 110. Two heat sink elements 111 are arranged as parts projecting from the inner surfaces of the parts of the housing 110. Each heat sink element thermal 111 has the form of a plate with an internal profile 113 following the internal shape of the parts of
    23/26 housing 110, and a straight opposite outer edge 114. In the present embodiment, the housing parts 11.0 and the heat sink elements 111 are in thermal contact after the lighting device is assembled, so that they can be related to a large heat sink element. Each of the clamps 130 is attached to one of these heat sink elements 111. Properly selecting the shape, elasticity and material of the clamps 130, a predetermined distributed mechanical force is applied to clamp the clamps 130 and ensure sufficient thermal connection between the clamps 130 and the heatsink elements 111.
    lighting device 110 comprises a socket 140 for connecting the lighting device to a luminaire, for example, a base screw. Wires 701 are arranged in electrical contact with the light sources 121, preferably because they are connected to the terminals facing upwards, and are mechanically fixed to the clips 130 through the light sources 121. The wires 701 are arranged to pass through the respective cut teeth 702 in the heat sink elements 111, so that each wire 701 is located on this side of the heat sink element 111 which is opposite the light source 121 whose wire 701 feeds.
    With reference to figure 9, the heat sink elements 111 are separated by a constant distance. Among the heat sink elements, an overlapping zone 901 is defined. After passing through the indentations 702, the wires 701 are taken through the overlapping zone 901 to the socket 140. Thus, when the socket 140 is connected to a power source, the wires 701 can supply electrical energy to the light sources 121.
    A lighting device 100 according to the present embodiment can be assembled in two stages. A stage comprises forming two halves, each consisting of
    24/26 a part of the housing 110 and a heat sink element 111, optionally molded as a common piece, for example, of a ceramic material. In each of these halves, a clip 130, light sources 121 and wires 701 are arranged. In a second step, the two halves are assembled together to form the lighting device 100, and a socket 140 can also be attached.
    Figure 8 illustrates an embodiment of a lighting device 100 in accordance with the concept of the present invention. The lighting device is illustrated in an assembled state to show its main parts. Figure 9 is a top cross-sectional view of the lighting device shown in Figure 8, however, in an assembled state.
    The lighting device 100 comprises light sources 121, arranged to generate light, which are mounted on the electrically conductive layers 120, for example, including metallic particles or metallic elements in positions where they help to reduce the thermal resistance between the upper and lower sides of the layer. The light sources can be provided as an LED package in the electrically conductive layer 120 or they can be mounted in a single mold that acts as the electrically conductive layer 120; the latter option is preferable when excellent thermal conductivity through the conductive / heat sink layer interface is desired. In these circumstances, the thermal conductivity in this layer is not a mandatory feature. It should be noted that there are light sources not visible in figure 8 since they are mounted face down on one of the electrically conductive layers 120. Light sources 121 are, for example, LEDs of arbitrary color. Light sources 121 and electrically conductive layers 120 are surrounded by an enclosure consisting of two parts of enclosure 110. Two elements
    25/26 heat sinks 111 are arranged as projecting parts from the internal surfaces of the housing parts 110. Each heat sink element 111 is the plate formed with an internal profile 113 following the internal shape of the housing parts 110, and an opposite outer edge straight 114. In the present embodiment, the housing parts 110 and the heat sink elements 111 are in thermal contact after the lighting device 100 is assembled, so that they can be referred to as a large heat sink element.
    In each of the heat sink elements 111, a recess 703 is provided with a shape corresponding to that of one of the electrically conductive layers 120. The electrically conductive layers 120 are glued to the heat sink elements 111, in which the recesses 703 help to align the layers electrically corresponding conductive 120 and thus also light sources 121. When the electrically conductive layers 120 are received in their respective recesses 703, the movement of the electrically conductive layers 120 in their respective planes is limited.
    The lighting device 100 comprises a socket 140 for connecting the lighting device to a luminaire, for example, a base screw. Wires 701 extending from the bushing 140 are attached at one end to the electrically conductive layer 120, more precisely in electrical contact with the light sources 121. The wires 701 are arranged to pass through the indentations 702 cut at the edges of the heat sink elements 111, so that each wire 701 is located on this side of the heat sink element 111, which is opposite the light source 121 whose wire 701 supplies.
    With reference to figure 9, which is common to figures 7
    26/26 and 8, the heat sink elements 111 are separated by a constant distance. Among the heatsink elements 111, an overlapping zone 901 is defined. After passing through the dentations 702, the wires 701 are taken through the overlapping zone 901 to the socket 140. Thus, when the socket 140 is connected to a power source, the wires 701 can supply electrical energy to the light sources 121.
    A lighting device 100 according to the present embodiment can be assembled in two stages. A step comprises forming two halves, each consisting of a part of the housing 110 and a heat sink element 111, optionally shaped as a common piece, for example, of a ceramic material. In each of these halves, an electrically conductive layer 120, light sources 121 and wires 701 can be arranged. In a second step, the two halves are assembled together to form the lighting device 100, and a socket 140 can also be attached.
    Above, embodiments of the lighting device and method according to the concept of the present invention as defined in the appended claims have been described. These should be seen as merely non-limiting examples. As understood by a person skilled in the art, many alternative modifications and embodiments are possible within the scope of the invention concept. It is noted, that for the purposes of this application, and in particular with reference to the appended claims, the word comprising does not exclude other elements or steps, and the word one or one does not exclude a plurality.
    权利要求:
    Claims (15)
    [1]
    1. LIGHTING DEVICE (100), comprising:
    at least one light source (121) arranged to generate the light;
    an electrically insulating heat sink element (111); and an electrically conductive layer (120);
    wherein at least one said light source is arranged in contact with said electrically conductive layer (120), wherein said electrically conductive layer is mounted on said heat sink element by means of a mechanical fixing means, and characterized by said the electrically conductive layer is folded on a fold axis around said heat sink element.
    [2]
    2. LIGHTING DEVICE, according to claim 1, characterized in that said fixing means is arranged to distribute a mechanical force in the predetermined positions.
    [3]
    3. LIGHTING DEVICE, according to claim 1, characterized in that said fixing means is a clamp.
    [4]
    4. LIGHTING DEVICE, according to claim 1, characterized in that said electrically conductive layer is arranged having electrical cables arranged to supply at least one said light source.
    [5]
    5. LIGHTING DEVICE, according to claim 1, characterized in that said electrically conductive layer is flexible.
    [6]
    6. LIGHTING DEVICE, according to claim 1, characterized in that it additionally comprises an insulating layer disposed on said electrically conductive layer.
    [7]
    7. LIGHTING DEVICE, according to the
    Petition 870190091585, of 9/13/2019, p. 9/13
    2/3 claim 1, characterized by the insulating layer when present and / or the fixing means are reflective.
    [8]
    8. LIGHTING DEVICE, according to claim 1, characterized in that said electrically conductive layer is arranged in said fixing means.
    [9]
    9. LIGHTING DEVICE, according to claim 1 or 3, characterized by said electrically conductive layer and said fixing means coincide.
    [10]
    10. LIGHTING DEVICE, according to claim 1, characterized by:
    said fixing means is a recess (703), having a shape corresponding to that of said electrically conductive layer, in said thermal dissipating element; and said electrically conductive layer is glued to said heat sink element.
    [11]
    11. LIGHTING DEVICE, according to claim 9 or 10, characterized in that it additionally comprises auxiliary linear electrical connection means (701) extending to at least one said light source.
    [12]
    12. LIGHTING DEVICE, according to claim 11, characterized in that each of said linear connection means is located on the side of said thermal dissipating element that is opposite the light source until this linear connection means extends.
    [13]
    13. LIGHTING DEVICE, according to claim 12, characterized in that said thermal dissipating element comprises two overlapping parts between what is defined as an overlapping zone (901), in which said linear connection means are arranged.
    [14]
    LIGHTING DEVICE, according to claim 1, characterized in that it further comprises a housing (110) surrounding said light source and said thermal dissipating element.
    Petition 870190091585, of 9/13/2019, p. 10/13
    3/3
    [15]
    15. METHOD FOR PROVIDING A DEVICE OF
    LIGHTING, characterized by understanding:
    provision of an electrically conductive layer;
    mounting at least one light source in one
    Top surface of said electrically conductive layer;
    bending the electrically conductive layer on a bending axis; and fixing the electrically conductive layer to an electrically insulating thermal dissipating element, so that an underside of the electrically conductive layer is arranged in direct contact with said thermal dissipating element, in which the step of fixing the electrically conductive layer to said element The heat sink is made by means of a mechanical fixing means, and in which the electrically conductive layer 15 is folded around said heat sink element.
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    同族专利:
    公开号 | 公开日
    WO2012095758A2|2012-07-19|
    JP2014507048A|2014-03-20|
    CN103443537A|2013-12-11|
    US20150103538A1|2015-04-16|
    US9115853B2|2015-08-25|
    JP5984845B2|2016-09-06|
    CN103443537B|2018-09-21|
    BR112013017690A2|2016-10-11|
    RU2013137431A|2015-02-20|
    EP2663805A2|2013-11-20|
    EP2663805B1|2017-07-19|
    WO2012095758A3|2012-11-08|
    RU2607531C2|2017-01-10|
    US20130286645A1|2013-10-31|
    TWI567334B|2017-01-21|
    US9897262B2|2018-02-20|
    TW201239256A|2012-10-01|
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    法律状态:
    2016-11-22| B25A| Requested transfer of rights approved|Owner name: PHILIPS LIGHTING HOLDING B.V. (NL) |
    2018-03-27| B15K| Others concerning applications: alteration of classification|Ipc: F21K 9/232 (2016.01), F21K 9/90 (2016.01), F21V 3/ |
    2018-12-18| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-07-16| B06T| Formal requirements before examination [chapter 6.20 patent gazette]|
    2019-11-19| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2020-01-21| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 04/01/2012, OBSERVADAS AS CONDICOES LEGAIS. |
    2021-10-26| B21F| Lapse acc. art. 78, item iv - on non-payment of the annual fees in time|Free format text: REFERENTE A 10A ANUIDADE. |
    2022-02-15| B24J| Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)|Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2651 DE 26-10-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |
    优先权:
    申请号 | 申请日 | 专利标题
    EP11150537|2011-01-11|
    US201161569353P| true| 2011-12-12|2011-12-12|
    PCT/IB2012/050039|WO2012095758A2|2011-01-11|2012-01-04|Lighting device|
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